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Copper(I) Iodide (CuI)

Catalyst • electronics

Synonyms: cuprous iodide; Copper(I) iodide CAS: 7681‑65‑4 Formula: CuI • Mᵣ ≈ 190.45 Function: catalyst • electronics grade Appearance: white/off‑white powder (may tan on exposure) Solubility: insoluble in water; soluble in iodide complexes Compliance: REACH • RoHS (electronics) Non‑DG for transport Incoterms: FOB/CIF/EXW • Ports: Rotterdam / Antwerp
Assay (as CuI)
≥ 99.0–99.9% (by grade)
Copper content (theor.)
≈ 33.3%
Density
≈ 5.6 g/cm³
Melting point
≈ 605–610 °C
Loss on drying (105 °C)
≤ 0.5% (typ.)
Particle size
D90 ≤ 10–20 µm (fine); nano on request
Specs below are representative; shipped material conforms to the lot COA. Select grade by application (Ullmann couplings, click chemistry, perovskite HTL, iodide scavenging) and purity/particle size requirements.
Parameter Typical Spec
Assay (as CuI) ≥ 99.0% ≥ 99.0%
Loss on drying ≤ 0.3% ≤ 0.5%
Halides (Cl⁻/Br⁻) low ≤ specified
Appearance white to off‑white powder conforms
Applications Packaging Storage & Handling
• **Catalyst / co‑catalyst** — Ullmann‑type C–N/C–O/C–S couplings; CuAAC click chemistry source of Cu(I).
• **Electronics** — p‑type semiconductor; HTL for perovskite/LEDs; TCO/paste additive.
• **Iodide scavenger / reagent** — process and analytical uses.
• 25 kg fiber drums or HDPE drums, lined.
• 1 kg bottles / foil pouches for R&D & electronics.
• Custom small vacuum packs (electronic grade).
• Protect from light/air; store cool, dry, tightly closed.
• May discolor tan due to iodine; does not affect assay if controlled.
• Separate from acids/oxidizers; follow SDS PPE. Non‑DG for transport.
Need ultra‑low sodium/potassium or a defined particle size curve for printing pastes? Ask for the **electronics 3N** spec with ICP profile and sieve/laser PSD to match your process.

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